A report by The Information claims that the world’s biggest chipmaker is considering adding memory back into its portfolio, starting with next-generation 3D DRAM.
With demand still outpacing supply and prices sky-high, the outlet says it could compete with memory giants Micron, Samsung, and SK Hynix to develop and produce 3D DRAM technology that stacks chips vertically for increased bandwidth, capacity, and power efficiency.
[Link: TSMC Weighs Making Advanced Memory Chips to Capture More AI Spending | https://www.theinformation.com/articles/tsmc-weighs-making-advanced-memory-chips-capture-ai-spending?rc=v4bmzs | The Information]
I mean, at the end of the day the same fabs that build “normal RAM” are going to be the ones to build NNM, so as NNM has higher margins, they would opt for more NNM production, and the problem still wouldn’t be solved, as instead of using HBM, they’d use NNM, while at the same time, consumer RAM wouldn’t be as much produced.
I think that the best thing for us consumers is a unified standard, that both consumers and AI-centered compute can utilize, as in that way, there would be just one type of RAM needed to be built for everyone, but even then, it wouldn’t be really good, as the demand for this ideological unified RAM would have price through the roof since its demand would come from AI, so I really have no clue what would be a good solution for RAMpocalypse.
Or maybe, if you still want to have NNM, another possibility is to create entirely new companies, that are independent from the established RAM suppliers. Maybe in this way it could work, but I could be huffing too much hopium here…